全国服务热线| No. | Part Number | Pin Count | Grid Size | IC Body Size (mm) |
| 1 | IC264-22501-1-NN-MF | 225 | 15x15 | |
| 2 | IC264-22501-1-NP-MF | 225 | 15x15 | |
| 3 | IC264-22501-1-PN-MF | 225 | 15x15 | |
| 4 | IC264-22501-1-MF | 225 | 15x15 | |
| 5 | IC264-22501-1-NN | 225 | 15x15 | |
| 6 | IC264-22501-1-NP | 225 | 15x15 | |
| 7 | IC264-22501-1-PN | 225 | 15x15 | |
| 8 | IC264-22501-1 | 225 | 15x15 |
Features
Pin count 225
Pitch size 1.5mm
Open top type sockets for BGA packages, with push-down frame for automated handling
Specifications
Insulation Resistance: 1,000M min. at 500V DC
Dielec. Withstd. Voltage: 100V AC for 1 minute
Contact Resistance: 1 max. at 10mA/20mV
max.
Operating Temp. Range: –40°c to +150°c
Mating Cycles: 10,000 insertions min.
Contact force: 25g to 35g per individual
contact pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
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YAMAICHI-BGA-ic264规格书 |
