| No. | Part Number | Pin Count | Pitch | Grid Size | IC Dimensions | Socket Dimensions | ||||
| A | B | D | E | F | ||||||
| 1 | NP291-03617-* | 36 | 0.75 | 6x6(F) | 6.5 | 10.5 | 0.57-0.81 | 28.3 | 27.3 | 17.3 |
| 2 | NP291-04002-G4-BF-* | 40 | 0.75 | 5x8(F) | 7.48 | 5.74 | 0.715 | 27.5 | 22.5 | 17.3 |
| 3 | NP291-04009-G4-BF-* | 40 | 0.75 | 5x8(F) | 7.508 | 5.857 | 0.715 | 27.5 | 22.5 | 17.3 |
| 4 | NP291-04013-* | 40 | 0.75 | 6x10 | 5.55 | 9.1 | 0.555 | 18 | 24 | 15.4 |
| 5 | NP291-04414-* | 44 | 0.75 | 6x11 | 7.75 | 14.35 | 0.555 | 18 | 24 | 15.4 |
| 6 | NP291-04805-1-* | 48 | 0.75 | 6x8(F) | 9 | 15 | 0.30-0.80 | 32 | 32 | 19 |
| 7 | NP291-04805-2-* | 48 | 0.75 | 6x8(F) | 8 | 14 | 0.30-0.80 | 32 | 32 | 19 |
| 8 | NP291-04805-3-* | 48 | 0.75 | 6x8(F) | 6 | 8 | 030-0.80 | 32 | 32 | 19 |
| 9 | NP291-04805-4-* | 48 | 0.75 | 6x8(F) | 7.2 | 11.65 | 0.30-0.80 | 32 | 32 | 19 |
| 10 | NP291-04805-5-* | 48 | 0.75 | 6x8(F) | 6.2 | 13.75 | 0.30-0.80 | 32 | 32 | 19 |
| 11 | NP291-04808-2-G4-BF-P | 48 | 0.75 | 8x6(F) | 7.58 | 9.81 | 0.715 | 28.3 | 27.3 | 17.3 |
| 12 | NP291-04812-2-G4-BF-P | 48 | 0.75 | 8x6(F) | 7.91 | 6.5 | 0.715 | 28.3 | 27.3 | 17.3 |
| 13 | NP291-07210-2AC08904 | 54 | 0.75 | 8x9(F) | 7.67 | 16.37 | 0.715 | 28.4 | 33.9 | 17.3 |
| 14 | NP291-07210-2AC08338 | 56 | 0.75 | 8x9(F) | 7.67 | 16.37 | 0.715 | 28.4 | 33.9 | 17.3 |
| 15 | NP291-07210-2-G4-BF-P | 72 | 0.75 | 8x9(F) | 7.67 | 16.37 | 0.715 | 28.4 | 33.9 | 17.3 |
| 16 | NP291-07423-1 | 74 | 0.75 | 7x16 | 7.08 | 12.44 | 0.37 | 16.8 | 22 | 15.8 |
| 17 | NP291-28807-* | 288 | 0.75 | 22x 22 | 18 | 18 | 0.85 | 40 | 40 | 19.3 |
Features
Pin counts 36, 40, 44, 48, 54, 56, 72, 168 and 288
Pitch size 0.75mm
Open top type sockets for FBGA packages
Self contacting structure without upper pressing force package
Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
Specifications
Insulation Resistance:1,000M min. at 100V DC
Dielec. Withstd. Voltage:100V AC for 1 minute
Contact Resistance:100m max. at 10mA/20mV max.
Operating Temp. Range:–55°c to +170°c
Contact force:15g per pin approx.
Materials and Finish
Housing:
Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts:
Beryllium Copper (BeCu)
Plating:Gold over Nickel
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YAMAICHI-FBGA-np291规格书 |

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