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YAMAICHI-FBGA-np291

作者:小编时间:2023-10-15 13:41:17次浏览

信息摘要:

日本山一FBGA系列IC烧录座,日本山一FBGA系列IC烧录夹,日本山一FBGA系列IC测试夹具,日本山一FBGA系列IC测试治具,日本山一FBGA系列IC测试座,日本山一FBGA系列IC测试插座,日本山一FBGA系列IC测试夹,日本山一FBGA系列IC老化座。NP291-03617-*,NP291-04002-G4-BF-*,NP291-04009-G4-BF-*,NP291-04013-*,NP291-04414-*,NP291-04805-1-*,NP291-04805-2-*,NP291-04805-3-*,NP291-04805-4-*,NP291-04805-5-*,NP291-04808-2-G4-BF-P,NP291-04812-2-G4-BF-P,NP291-07210-2AC08904,NP291-07210-2AC08338,NP291-07210-2-G4-BF-P,NP291-07423-1,NP291-28807-*

No. Part Number Pin Count Pitch Grid Size IC Dimensions Socket Dimensions
A B   D E F
1 NP291-03617-* 36 0.75 6x6(F) 6.5 10.5 0.57-0.81 28.3 27.3 17.3
2 NP291-04002-G4-BF-* 40 0.75 5x8(F) 7.48 5.74 0.715 27.5 22.5 17.3
3 NP291-04009-G4-BF-* 40 0.75 5x8(F) 7.508 5.857 0.715 27.5 22.5 17.3
4 NP291-04013-* 40 0.75 6x10 5.55 9.1 0.555 18 24 15.4
5 NP291-04414-* 44 0.75 6x11 7.75 14.35 0.555 18 24 15.4
6 NP291-04805-1-* 48 0.75 6x8(F) 9 15 0.30-0.80 32 32 19
7 NP291-04805-2-* 48 0.75 6x8(F) 8 14 0.30-0.80 32 32 19
8 NP291-04805-3-* 48 0.75 6x8(F) 6 8 030-0.80 32 32 19
9 NP291-04805-4-* 48 0.75 6x8(F) 7.2 11.65 0.30-0.80 32 32 19
10 NP291-04805-5-* 48 0.75 6x8(F) 6.2 13.75 0.30-0.80 32 32 19
11 NP291-04808-2-G4-BF-P 48 0.75 8x6(F) 7.58 9.81 0.715 28.3 27.3 17.3
12 NP291-04812-2-G4-BF-P 48 0.75 8x6(F) 7.91 6.5 0.715 28.3 27.3 17.3
13 NP291-07210-2AC08904 54 0.75 8x9(F) 7.67 16.37 0.715 28.4 33.9 17.3
14 NP291-07210-2AC08338 56 0.75 8x9(F) 7.67 16.37 0.715 28.4 33.9 17.3
15 NP291-07210-2-G4-BF-P 72 0.75 8x9(F) 7.67 16.37 0.715 28.4 33.9 17.3
16 NP291-07423-1 74 0.75 7x16 7.08 12.44 0.37 16.8 22 15.8
17 NP291-28807-* 288 0.75 22x 22 18 18 0.85 40 40 19.3

Features
Pin counts 36, 40, 44, 48, 54, 56, 72, 168 and 288
Pitch size 0.75mm
Open top type sockets for FBGA packages
Self contacting structure without upper pressing force package
Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
 
Specifications
Insulation Resistance:1,000M min. at 100V DC
Dielec. Withstd. Voltage:100V AC for 1 minute
 
Contact Resistance:100m max. at 10mA/20mV max.
 
Operating Temp. Range:–55°c to +170°c
 
Contact force:15g per pin approx.
 
Materials and Finish
 
Housing:
Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
 
Contacts:
Beryllium Copper (BeCu)
Plating:Gold over Nickel
 
YAMAICHI-FBGA-np291(图1) YAMAICHI-FBGA-np291规格书

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