全国服务热线| No. | Part Number | Pin Count | IC Dimensions | Socket Dimensions | |
| Grid Size | Body Size(mm) | AxB | |||
| 1 | NP352-106426-* | 1064 | 43x43 | 45x 45 | 74.0x74.0 |
| 2 | NP352-115523 | 1155 | 34x34 | 35 x 35 | 62.0x62.0 |
| 3 | NP352-1206-38 | 1206 | 36x36 | 37.5x 37.5 | 62.0x62.0 |
Features
Pin count 48 to 1849
Pitch size 1.00mm
Open top type sockets for FBGA packages
Self contacting structure without upper pressingforce (ZIF)
Contacting structure to nip the sides of solder balls to lower damages of coplanarity of solder balls
Specifications
Insulation Resistance:1,000M min. at 100V DC
Dielec. Withstd. Voltage:100V AC for 1 minute
Contact Resistance:100m max. at 10mA/20mV max.
Operating Temp. Range:
–40°c to +150°c
–55°cto +150°c
Contact force:15g per pin approx.
Mating Cycles:10,000 insertions min.
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YAMAICHI-FBGA-np352-1064规格书 |
