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ENPLAS-BGA-484AP-0.5mm-SMD

作者:小编时间:2023-12-05 10:02:53次浏览

信息摘要:

ENPLAS-BGA系列IC测试座,ENPLAS-BGA系列IC测试插座,ENPLAS-BGA系列IC测试夹,ENPLAS-BGA系列IC老化座,ENPLAS-BGA系列IC烧录座,ENPLAS-BGA系列IC烧录夹,ENPLAS-BGA系列IC测试夹具,ENPLAS-BGA系列IC测试治具。BGA-48(484AP)-0.5-***,BGA-48(484AP)-0.5-***,BGA-57(484AP)-0.5-***,BGA-89(484AP)-0.5-***,BGA-96(484AP)-0.5-***,BGA-144(484AP)-0.5-***,BGA-144(484AP)-0.5-***,BGA-132(484AP)-0.5-***,BGA-161(484AP)-0.5-***,BGA-156(484AP)-0.5-***,BGA-277(484AP)-0.5-***,BGA-240(484AP)-0.5-***,BGA-223(484AP)-0.5-***,BGA-256(484AP)-0.5-***,BGA-244(484AP)-0.5-***。

No. PART NO. APPLICABLE IC DIMENSIONS(REF.) OUTSIDE DIMENSIONS(REF.) REMARKS
BODY SIZE GRID ROW/ARRAY LEADS NUMBER pitch A B C
1 BGA-48(484AP)-0.5-*** 4x4 7X7 Depopulated 48 0.5 40 38 15  
2 BGA-48(484AP)-0.5-*** 5x5 8x8 Depopulated 48
3 BGA-57(484AP)-0.5-*** 5x5 9x9 Depopulated 57
4 BGA-89(484AP)-0.5-*** 6x6 10x10 Depopulated 89
5 BGA-96(484AP)-0.5-*** 6x6 11x11 Depopulated 96
6 BGA-144(484AP)-0.5-*** 7X7 12x12 Depopulated 144
7 BGA-144(484AP)-0.5-*** 7X7 13x13 Depopulated 144
8 BGA-132(484AP)-0.5-*** 8x8 14x14 Depopulated 132
9 BGA-161(484AP)-0.5-*** 8x8 15x15 Depopulated 161
10 BGA-156(484AP)-0.5-*** 9x9 17x17 Depopulated 156
11 BGA-277(484AP)-0.5-*** 10X10 18x18 Depopulated 277
12 BGA-240(484AP)-0.5-*** 10x10 19x19 Depopulated 240
13 BGA-223(484AP)-0.5-*** 11x11 20x20 Depopulated 223
14 BGA-256(484AP)-0.5-*** 11x11 21x21 Depopulated 256
15 BGA-244(484AP)-0.5-*** 12x12 21x21 Depopulated 244

Specification/仕様
0.4mm Pitch 0.5mm Pitch 0.65mm Pitch
APS BPS APS BPS PS
Contact resistance 接触抵抗(初期値)
(at initial, at 10mA) 400mΩ 200mΩ 400mΩ 200mΩ 500mΩ
Maximum voltage 耐電圧 AC300V RMS (for 1 minute)
Insulation resistance 絶縁抵抗
at DC 500V 1,000 MΩ or higher
Rated current 許容電流値 0.7A 1.4A 0.6A 2.4A 0.2A
Operating temperature range 使用温度 -65℃〜+150℃
Insertion 機械寿命 Min 10,000 times (Mechanical)
MATERIAL/材質
Body 本体 PEI, PES
Contact コンタクト BeCu, Au plating (Ni-base)

【BGA_LGA-CLAM-SHELL90D7规格书】

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