| No. | Part Number | Pin Count | IC D imensions | Socket Dimensions | |
| Grid Size | Body Size(mm) | AxB | |||
| 1 | NP396-500 | ||||
Features
Open top type sockets for BGA packages
Coverless shrink version
2-point Tweezer Contact System
Specifications
Insulation Resistance:1,000MW min. at 100V DC
Dielectric Withstanding Voltage:100V AC for 1 minute
Contact Resistance:30mW max. at 10mA/20mV max.
Operating Temperature Range:
–55°C to +150°C
–40°C to +170°C
Contact Force:13g per pin approx.
Operationg Force:3.2 Kg
Mating Cycles:10,000 insetions
Materials and Finish
Housing:Polyetherimide (PEI), glass-filled
Contacts:Beryllium Copper (BeCu)
Plating:Gold over Nickel
![]() |
YAMAICHI-SBGA-np396规格书 |

全国服务热线
