全国服务热线| No. | Part Number | Pin Count | IC D imensions | Socket Dimensions | |
| Grid Size | Body Size(mm) | AxB | |||
| 1 | YED550-10-256K16102 | ||||
| 2 | YED550-10-256M16166 | ||||
| 3 | YED550-10-256N16166 | ||||
| 4 | YED550-10-256L16166 | ||||
| 5 | YED558-10-256K16102 | ||||
| 6 | YED558-10-256M16166 | ||||
| 7 | YED558-10-256N16166 | ||||
| 8 | YED558-10-256L16166 | ||||
Features
Contacts are arranged in grid paterns with a pitch of 1.00, 1.50, 1.27and 2.54mm. Any pin count and pin layout within the given grids is available
The best way to make BGA pluggable without
changing layout design
The socket and PCB adapter provide a high density
and low profile board interconnect system
Specifications
Insulation Resistance: 10,000M min. at 500VRMS
Dielec. Withstd. Voltage: 500VRMS
Max Working Voltage 100Vrms/150VDC for >1.27mm
Max Working Voltage 50Vrms/60VDC for >1.00mm
Contact Resistance: 10m max. at 100mA/20mV
Current Rating: 1A
Operating Temp. Range: -55°c ~ +125°c
Capacitance: max. 1pF at 1kHz
Mating Cycles: max. 2nH per pin.
Mating Cycles: 100 insertions min.
Materials and Finish
Insulator: Laminated glass-epoxy FR4 UL94V-0
Contacts(stamped): Beryllium Copper, clip Gold over Nickel
Sleeve (machined): Brass, Tin Lead over Nickel
Adapter Pins (machined): Brass, Gold over Nickel
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YAMAICHI-SMT适配插座规格书 |
