Features
Open top socket for BGA / LGA / CSP packages with 0.50mm pitch 18 x 18 maximum grid size
SMT soldering (0.50mm pitch)
Open top type sockets for FBGA packages
Depopulation versions available
Specifications
Insulation Resistance:1,000M min. at 100V DC
Dielec. Withstd. Voltage:100V AC for 1 minute
Contact Resistance:100m max. at 10mA/20mV max.
Operating Temp. Range:–40°c to +150°c
Contact force:6gf per pin approx.
Materials and Finish
Housing:
Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts:
Beryllium Copper (BeCu)
Plating:Gold over Nickel

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